Temp at Level 3 data centers

Roy r.engehausen at gmail.com
Fri Oct 13 18:10:51 CST 2017


The IBM 308x and 309x series mainframes were water cooled.  They did 
have Thermal Conduction Modules which had a helium-filled metal cap, 
which contains one piston per chip; the piston presses against the back 
of each chip to provide a heat conduction path from the chip to the 
cap.  The cap was connected to the chilled water supply.

On 10/13/2017 10:51 AM, Chris Adams wrote:
> Once upon a time, bzs at theworld.com <bzs at theworld.com> said:
>> Also, the IBM 3090 at least, was cooled via helium-filled pipes kind
>> of like today's liquid cooled systems. It was full of plumbing. If you
>> opened it up some chips were right on copper junction boxes (maybe
>> they were just sensors but it looked cool.)
> Cray supercomputers had Freon lines through them for cooling, up until
> the last generation of the "old school" supercomputer.  That was not
> sufficient to keep it cool, so they sealed the chassis (which was huge)
> and pumped it full of 4 tons of Fluorinert.



More information about the NANOG mailing list