[TSP 2017] Call for Reviewers - IEEE R8 Technically Co-Sponsored 40th Int. Conf. on Telecommunications and Signal Processing, Barcelona, Spain, July 5-7, 2017

TSP 2017 tspprmng at feec.vutbr.cz
Sat Feb 18 01:40:39 UTC 2017

Dear Colleague,

The Organizing Committee of the 2017 40th International Conference on 
Telecommunications and Signal Processing (TSP - /http://tsp.vutbr.cz//) 
seeks for acknowledged specialists to participate in the review process 
and support the TSP community with the evaluation of 2 or 3 manuscripts. 
To appreciate this effort, we are glad to offer to reviewers an 
authorization for reduced conference registration fee.

The TSP 2017 Conference will be held during July 5-7, 2017, in 
Barcelona, Spain and it is organized in cooperation with the IEEE Region 
8 (Europe, Middle East and Africa), IEEE Spain Section, IEEE 
Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, and IEEE Croatia Section Communications Chapter by sixteen 
universities from Czech Republic, Hungary, Turkey, Taiwan, Japan, Slovak 
Republic, Spain, Bulgaria, France, Slovenia, Croatia, and Poland for 
academics, researchers, and developers and it serves as a premier annual 
international forum to promote the exchange of the latest advances in 
telecommunication technology and signal processing.

To register yourself, please visit the 
http://tsp.vutbr.cz/tsp2017/openconf/openconf.php website and enter the 
"*tsp17rev*" password into the "*Sign Up — Keycode:*" field and click on 
"*Enter*" button. In addition to *selection of maximum 3 Topic Areas*, 
please *enter to "Keywords"*field *at least 7 semi comma (;) separated 
specific keywords *from the field of your expertise in order to ensure 
proper manuscript assignment.

The manuscript assignment process will be launched in the second half of 
March 2017 and you will be informed by automatic email notification. 
Thank you in advance for your collaboration.

With best regards,

Norbert Herencsar and Marcos Faundez-Zanuy
TSP 2017 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz <mailto:tsp at feec.vutbr.cz>

Follow us on:
- Facebook https://www.facebook.com/tspconf
- Twitter https://twitter.com/tspconf
doc. Ing. Norbert Herencsar, Ph.D., IEEE Senior Member - IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter Chair
Department of Telecommunications
Brno University of Technology
Brno, Czech Republic


Prof. Dr. Marcos Faundez-Zanuy - Dean
Escola Universitaria Politecnica de Mataro, Tecnocampus
Mataro, Spain

--------------------End of Message--------------------

More information about the NANOG mailing list